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Smart Materials Congress 2019
Nano Research and Applications
ISSN: 2471-9838
Page 24
August 01-02, 2019
Dublin, Ireland
Smart Materials and
Structures
8
th
International Conference on
Microstructure simulator to predict grain formation during
thermo-mechanical processing of long products
Ahmad Fakih
Friedrich Kocks GmbH & Co KG, Germany
T
oday, temperature-controlled rolling is a well-
known application in rolling mills to improve the
technological properties of the materials in accordance
with the market requirements. In comparison to standard
operation procedures, this processing especially requires
a reliable and holistic concept in daily operation. It
becomes even more important, when special demands
need to be met especially with fast reaction times
concerning first results. In order to fulfill such demands
successfully without the necessity of extensive
test trials, an overall integrated concept for thermo-
mechanical rolling of long products has been developed.
Special attention is placed on a recently developed
microstructure simulator. It is a semi-empirical model
for temperature and process calculation predicting the
resulting grain sizes, microstructure distribution and
mechanical properties. Especially with its customized,
flexible database, which can be individually extended, the
producers are enabled to react fast tomarket movements
and specific requirements. The simulation software has
its focus on the specific microstructure evolution of long
products e.g. bar, wire rod and tubes. The simulation
model features an analytic model to calculate strain
distribution for different reduction configurations and
varieties of technological parameters, e.g. temperature,
speed, pass geometry for standard mill configurations as
well as for the 3-roll technology. Based on the distribution
of the strain modification and temperatures over the
cross-section of the rolled product, the microstructure
simulation is carried out to get a realistic image of the
final obtained micro-structural formation.
fakih@kocks.deAhmad Fakih, Nano Res Appl 2019, Volume 05